General Information
Organizing Committee
Program Committee
Important Dates
Submission Guidelines
Call for Research Papers

First International Workshop on Social Sensing (SocialSens 2015) Home

Social sensing has emerged as a new paradigm for collecting sensory measurements by means of "crowd-sourcing" sensory data collection tasks to a human population. Humans can act as sensor carriers (e.g., carrying GPS devices that share location data), sensor operators (e.g., taking pictures with smart phones), or as sensors themselves (e.g., sharing their observations on Twitter). The proliferation of sensors in the possession of the average individual, together with the popularity of social networks that allow massive information dissemination, heralds an era of social sensing that brings about new research challenges and opportunities in this emerging field.

The first international workshop on social sensing will bring together researchers and engineers from academia, industry, and government to present recent advances in both theoretical and experimental research. The scope of the workshop includes social sensing, ubiquitous, mobile and pervasive sensing, participatory and opportunistic sensing, urban sensing, social signal processing, information and coding theory, information processing and knowledge discovery from sensor data, data reliability, privacy and security issues, cyber-physical-systems with human-in-the-loop. We invite technical papers describing original ideas, exciting results, and/or real-world experiences involving the social sensing paradigm.

SocialSens 2015 is co-located with IEEE MASS 2015

General Chair
  • Bolek Szymanski, Rensselaer Polytechnic Institute, USA

Program Chair
  • Dong Wang, University of Notre Dame, USA

Steering Committee
  • Tarek Abdelzaher, University of Illinois at Urbana-Champaign, USA
  • Charu Aggarwal, IBM Research, USA
  • Coty Gonzales, Carnegie Mellon University, USA
  • Jiawei Han, University of Illinois at Urbana Champaign, USA
  • Mani Srivastava, UCLA, USA
  • Bolek Szymanski, Rensselaer Polytechnic Institute, USA

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